RTPXA270C5C624

Product Summary

The RTPXA270C5C624 is a processor. It provides industry-leading multimedia performance, low-power capabilities, rich peripheral integration and second generation memory stacking. Designed from the ground up for wireless clients, the RTPXA270C5C624 incorporates the latest Intel advances in mobile technology over its predecessor. These same attributes and features also make the processor ideal for embedded applications. The RTPXA270C5C624 processor redefines scalability by operating from 104 MHz up to 624 MHz, providing enough performance for the most demanding mobile applications.

Parametrics

RTPXA270C5C624 absolute maximum ratings: (1)TS, Storage temperature: –40 to 125℃; (2)VCC_OL1, Offset voltage between any of the following pins:–0.3 to 0.3 V; (3)VCC_OL2, Offset voltage between any of the following pins: –0.3 to 0.3 V; (4)VCC_OH1, Offset voltage between any of the following pins: –0.3 to 0.3 V; (5)VCC_OH2, Offset voltage between any of the following pins: –0.3 to 0.3 V; (6)VCC_OH3, Offset voltage between VCC_LCD<0> and VCC_LCD<1>: –0.3 to 0.3 V; (7)VCC_HV, Voltage applied to high-voltage supply pins: VSS–0.3 to VSS+4.0 V; (8)VCC_LV, Voltage applied to low-voltage supply pins: VSS–0.3 to VSS+1.45 V; (9)VIP, Voltage applied to non-supply pins except PXTAL_IN, ; (10)PXTAL_OUT, TXTAL_IN, and TXTAL_OUT pins: VSS–0.3 to VSS+4.0 V; (11)VIP_X, Voltage applied to XTAL pins: VSS–0.3 to VSS+1.45 V; (12)VESD, Maximum ESD stress voltage, three stresses maximum: 2000 V; (13)IEOS, Maximum DC input current (electrical overstress) for any ; (14)non-supply pin: 5 mA.

Features

RTPXA270C5C624 features: (1)High-performance processor; (2)256 Kbytes of internal SRAM for high speed code or data storage preserved during low-power states; (3)High-speed baseband processor interface (Mobile Scalable Link); (4)Rich serial peripheral set; (5)Hardware debug features IEEE JTAG interface with boundary scan; (6)Hardware performance-monitoring features with on-chip trace buffer; (7)Real-time clock; (8)Operating-system timers; (9)LCD Controller; (10)Universal Subscriber Identity Module interface; (11)Low power; (12)High-performance memory controller; (13)Flexible clocking:; (14)Additional peripherals for system connectivity.

Diagrams